八月30日在京大參加电漿研討會
大氣電漿是未來重要
生醫滅菌應用值得
東山莊晚宴
2007年8月30日
2007年8月28日
2007年8月24日
visit Japan
8月24日東横イン天満橋大手前地下鉄谷町線天満橋駅4番出口から徒歩7分 京阪天満橋駅から徒歩8分
8月27日京都四条大宮 阪急京都線大宮駅北1番出口より徒歩1分
8月28日の夕食会の場所は、"がんこ高瀬川二条苑" です。 18時30分で予約しています。メンバーはTed Wydeven> 穂積 啓一郎> 陳さんと息子さん> 辻 理>> 当日、何かあれば連絡して下さい。>> 辻 理>> ＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊>>> なお、"がんこ 高瀬川二条苑" の住所と電話番号は、> 〒604-0922> 京都市中京区木屋町通二条下ル東生州町484-6> TEL : 075-223-3456> HPアドレスは、> http://www.gankofood.co.jp/tenpo/oyashiki/takasegawanijoen.html
8月29日の夕食会の場所は-Y. Ikada and Kato Prof.
8月31日新大阪中央口新館 JR新大阪駅正面口徒歩5分
。
冷電漿聚合醇或矽烷膜的細胞親合性表面改質研究
Cell-compatibility Surface Modification by Cold Plasma Polymerization of Isopropanol or Hexamethyldisilazane
Ko-Shao Chen(陳克紹)*，Tsong-Rong Yan(顏聰榮)**，
Tsui-Chan Hung(洪翠禪)*，Shu-Juan Liao(廖淑娟)*，
Jing-Ping Wang(王景平)**，Ming-Yen Wu(吳明彥)*
*大同大學材料工程學系
**大同大學生物工程學系
摘要
本研究利用冷電漿聚合方法，於基材上沉積親水性或疏水性高分子膜，探討表面特性變化與細胞親合性關係。所使用的單體為異丙醇(Iso- propanol，IPA)及六甲基二矽胺烷(Hexamethyldisilazane,，HMDSZ)，以纖維母細胞或腸道細胞(Caco2)測試其細胞貼附性。結果發現，經HMDSZ疏水性電漿改質表面之細胞貼附性較差，有助於防止細胞貼附，而以異丙醇電漿處裡表面後，可使聚苯乙烯由70°水接觸角降至20°，變成親水性，且細胞貼附性不亞於市販細胞培養皿。
This study use cold plasma polymerization, deposition hydrophilic or hydrophobic polymer on the substrate, confers surface property change and cells compatibility. Using Iso- propanol and Hexamethyldisilazane as monomers, then fibroblastic cells and caco2 cells for test there cells compatibility. As a result, after HMDSZ hydrophobic plasma surface polymerization cells are suspend on the surface. On the other hand IPA plasma treated polystyrene surface water contact angle change from 70° drop to 20°, turn to hydrophilic, and the cells adherence is better then TCPS.
關鍵詞：電漿聚合、聚苯乙烯，纖維母細胞、腸道細胞
8月27日京都四条大宮 阪急京都線大宮駅北1番出口より徒歩1分
8月28日の夕食会の場所は、"がんこ高瀬川二条苑" です。 18時30分で予約しています。メンバーはTed Wydeven> 穂積 啓一郎> 陳さんと息子さん> 辻 理>> 当日、何かあれば連絡して下さい。>> 辻 理>> ＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊>>> なお、"がんこ 高瀬川二条苑" の住所と電話番号は、> 〒604-0922> 京都市中京区木屋町通二条下ル東生州町484-6> TEL : 075-223-3456> HPアドレスは、> http://www.gankofood.co.jp/tenpo/oyashiki/takasegawanijoen.html
8月29日の夕食会の場所は-Y. Ikada and Kato Prof.
8月31日新大阪中央口新館 JR新大阪駅正面口徒歩5分
。
冷電漿聚合醇或矽烷膜的細胞親合性表面改質研究
Cell-compatibility Surface Modification by Cold Plasma Polymerization of Isopropanol or Hexamethyldisilazane
Ko-Shao Chen(陳克紹)*，Tsong-Rong Yan(顏聰榮)**，
Tsui-Chan Hung(洪翠禪)*，Shu-Juan Liao(廖淑娟)*，
Jing-Ping Wang(王景平)**，Ming-Yen Wu(吳明彥)*
*大同大學材料工程學系
**大同大學生物工程學系
摘要
本研究利用冷電漿聚合方法，於基材上沉積親水性或疏水性高分子膜，探討表面特性變化與細胞親合性關係。所使用的單體為異丙醇(Iso- propanol，IPA)及六甲基二矽胺烷(Hexamethyldisilazane,，HMDSZ)，以纖維母細胞或腸道細胞(Caco2)測試其細胞貼附性。結果發現，經HMDSZ疏水性電漿改質表面之細胞貼附性較差，有助於防止細胞貼附，而以異丙醇電漿處裡表面後，可使聚苯乙烯由70°水接觸角降至20°，變成親水性，且細胞貼附性不亞於市販細胞培養皿。
This study use cold plasma polymerization, deposition hydrophilic or hydrophobic polymer on the substrate, confers surface property change and cells compatibility. Using Iso- propanol and Hexamethyldisilazane as monomers, then fibroblastic cells and caco2 cells for test there cells compatibility. As a result, after HMDSZ hydrophobic plasma surface polymerization cells are suspend on the surface. On the other hand IPA plasma treated polystyrene surface water contact angle change from 70° drop to 20°, turn to hydrophilic, and the cells adherence is better then TCPS.
關鍵詞：電漿聚合、聚苯乙烯，纖維母細胞、腸道細胞
2007年8月21日
ISPC Schedule
ISPC-18 (rev.3.16 June 30, 2007) Session Program: August 27 (Monday Afternoon), 2007 at Yoshida Campus
27P8-7 Carbon nanowalls with dispersed nanometal particles and evaluation of the field emission properties ID=385 T. Machino, M. Nakamura, K. Yamakawa, M. Hiramatsu and M. Hori
27P8-8 Growth of carbon nanowalls using electron beam excited plasma-enhanced chemical vapor deposition ID=455 T. Mori, M. Hiramatsu, K. Yamakawa, K. Takeda and M. Hori
27P8-21 Surface modification of polystyrene by plasma polymers of isopropanol or hexamethyldisilazane ID=527 Lin. Hong-Ru, CHen. Ko-shao, M.-Y. Wu, T.-C. Hung and S.-C. Chen
ISPC registration
The 18th International Symposium on Plasma Chemistry will be held in Kyoto, Japan on August 26 - 31, 2007.----- Original Message -----
From: <me@jtb.ne.jp> To: <kschen@ttu.edu.tw>
Sent: Thursday, May 24, 2007 4:30 PM
Subject: [MultiEntry] Confirmation of Registration For ISPC18> ************************************************************> Confirmation of Registration For > ISPC18> ************************************************************> > Prof. Ko Shao Chen> > Thank you very much for your registration. Your advanced > registration has been completed.> Please review the information below and present this > confirmation slip at the registration desk of the > conference site.
> ===========================================================> REGISTRATION
> ID Number : 258557
> Registration Details
> Registration Type : Regular> Accompanying Person : will Not attend
> Applicant : Prof. Ko Shao Chen> > Workshop : will Not attend> > Symposium dinner : will Not attend
> > Excursion : will Not attend> ============================================================> > Regular Registration Fee (Symposium) / early : JPY 46,000> ------------------------------------------------------------> Registration Fee Total : JPY 46,000> Payment Total : JPY 46,000> Balance Due : JPY 0
27P8-7 Carbon nanowalls with dispersed nanometal particles and evaluation of the field emission properties ID=385 T. Machino, M. Nakamura, K. Yamakawa, M. Hiramatsu and M. Hori
27P8-8 Growth of carbon nanowalls using electron beam excited plasma-enhanced chemical vapor deposition ID=455 T. Mori, M. Hiramatsu, K. Yamakawa, K. Takeda and M. Hori
27P8-21 Surface modification of polystyrene by plasma polymers of isopropanol or hexamethyldisilazane ID=527 Lin. Hong-Ru, CHen. Ko-shao, M.-Y. Wu, T.-C. Hung and S.-C. Chen
ISPC registration
The 18th International Symposium on Plasma Chemistry will be held in Kyoto, Japan on August 26 - 31, 2007.----- Original Message -----
From: <me@jtb.ne.jp> To: <kschen@ttu.edu.tw>
Sent: Thursday, May 24, 2007 4:30 PM
Subject: [MultiEntry] Confirmation of Registration For ISPC18> ************************************************************> Confirmation of Registration For > ISPC18> ************************************************************> > Prof. Ko Shao Chen> > Thank you very much for your registration. Your advanced > registration has been completed.> Please review the information below and present this > confirmation slip at the registration desk of the > conference site.
> ===========================================================> REGISTRATION
> ID Number : 258557
> Registration Details
> Registration Type : Regular> Accompanying Person : will Not attend
> Applicant : Prof. Ko Shao Chen> > Workshop : will Not attend> > Symposium dinner : will Not attend
> > Excursion : will Not attend> ============================================================> > Regular Registration Fee (Symposium) / early : JPY 46,000> ------------------------------------------------------------> Registration Fee Total : JPY 46,000> Payment Total : JPY 46,000> Balance Due : JPY 0
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